Advanced Packaging of RF MEMS Devices


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Advanced Packaging of RF MEMS Devices
10106011010608Advanced Packaging of RF MEMS Devices
<emphasis role="bold">Introduction</emphasis> Similar to IC packaging, packaging of radiofrequency (RF) MEMS devices must provide environmental protection, an electrical signal path, mechanical support, thermal dissipation and have a low parasitic capacity in the chip-substrate interconnection with low insertion loss and minimal interference. Packaging of RF MEMS devices should also prevent moisture and particulates, which may…
Citation
John H. Lau; Chengkuo Lee; C. S. Premachandran; Yu Aibin: Advanced MEMS Packaging. Advanced Packaging of RF MEMS Devices, Chapter (McGraw-Hill Professional, 2010), AccessEngineering Export