Accelerometer Packaging


Please sign in to view the rest of this entry.

Accelerometer Packaging
10106011010608Accelerometer Packaging
<emphasis role="bold">Introduction</emphasis> Microelectromechanical systems (MEMS) technology is penetrating every part of the electronics market and replacing existing technology with its advantages of smaller size and higher sensitivity. When replacing the conventional products with MEMS devices, one major drawback is the cost of the device. Since MEMS devices can be made with silicon wafers that have considerable yield, the overall device cost requir…
Citation
John H. Lau; Chengkuo Lee; C. S. Premachandran; Yu Aibin: Advanced MEMS Packaging. Accelerometer Packaging, Chapter (McGraw-Hill Professional, 2010), AccessEngineering Export