Optical MEMS Packaging: Bubble Switch


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Optical MEMS Packaging: Bubble Switch
101060110106061010608Optical MEMS Packaging: Bubble Switch
<emphasis role="bold">Introduction</emphasis> This chapter discusses the packaging and thermal reliability of the solder sealing ring of Restriction of the Use of Certain Hazardous Substances (RoHS) Directive–compliant three-dimensional (3D) bubble-actuated photonic cross-connect switches.
Citation
John H. Lau; Chengkuo Lee; C. S. Premachandran; Yu Aibin: Advanced MEMS Packaging. Optical MEMS Packaging: Bubble Switch, Chapter (McGraw-Hill Professional, 2010), AccessEngineering Export