Advanced MEMS Wafer-Level Packaging


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Advanced MEMS Wafer-Level Packaging
10106011010608Advanced MEMS Wafer-Level Packaging
<emphasis role="bold">Introduction</emphasis> Microelectromechanical systems (MEMS) technology has been investigated widely and vigorously by the research community for various applications over the past few years. Key factors for commercial success in MEMS devices include cost, yield, and reliability. Wafer-level packaging offers advantages and limitations that are substantially different from those of conventional packaging techn…
Citation
John H. Lau; Chengkuo Lee; C. S. Premachandran; Yu Aibin: Advanced MEMS Packaging. Advanced MEMS Wafer-Level Packaging, Chapter (McGraw-Hill Professional, 2010), AccessEngineering Export