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Enabling Technologies for Advanced MEMS Packaging
Enabling Technologies for Advanced MEMS Packaging10106011010608Enabling Technologies for Advanced MEMS PackagingIntroduction
As discussed in previous chapters, through-silicon vias (TSVs); wafer thinning; thin-wafer strength measurements; thin-wafer handling; chip-to-chip (C2C), chip-to-wafer (C2W), and wafer-to-wafer (W2W) bonding; and microelectromechanical systems (MEMS) wafer dicing are key enabling technologies for advanced MEMS packaging. This chapter presents TSVs, piezoresi…
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