Enabling Technologies for Advanced MEMS Packaging


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Enabling Technologies for Advanced MEMS Packaging
10106011010608Enabling Technologies for Advanced MEMS Packaging
<emphasis role="bold">Introduction</emphasis> As discussed in previous chapters, through-silicon vias (TSVs); wafer thinning; thin-wafer strength measurements; thin-wafer handling; chip-to-chip (C2C), chip-to-wafer (C2W), and wafer-to-wafer (W2W) bonding; and microelectromechanical systems (MEMS) wafer dicing are key enabling technologies for advanced MEMS packaging. This chapter presents TSVs, piezoresi…
Citation
John H. Lau; Chengkuo Lee; C. S. Premachandran; Yu Aibin: Advanced MEMS Packaging. Enabling Technologies for Advanced MEMS Packaging, Chapter (McGraw-Hill Professional, 2010), AccessEngineering Export