Advanced MEMS Packaging


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Advanced MEMS Packaging
10106011010608Advanced MEMS Packaging
<emphasis role="bold">Introduction</emphasis> This chapter briefly discusses the state of the art and future trends in advanced integrated circuit (IC) electronics packaging, followed by a discussion of advanced microelectromechanical systems (MEMS) packaging, where 10 different designs of three-dimensional (3D) MEMS packaging will be presented.
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Citation
John H. Lau; Chengkuo Lee; C. S. Premachandran; Yu Aibin: Advanced MEMS Packaging. Advanced MEMS Packaging, Chapter (McGraw-Hill Professional, 2010), AccessEngineering Export