About the Authors


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About the Authors
About the AuthorsJohn H. Lau earned a Ph.D. in theoretical and applied mechanics from the University of Illinois. He has also earned three master’s degrees. He currently is a visiting professor at the Hong Kong University of Science & Technology (HKUST). His research interests cover a broad range of enabling technologies for 3D IC and system-in-package integration for RoHS-compliant electronics, optoelectronics, photonics, and MEMS packaging. Prior to joining HKUST, Dr. Lau was the director of the Microsystems, Modules, and Components Laboratory at the Institute of Microelectronics in Singapore for 2 years and a Senior Scientist/MTS at Agilent/Hewlett-Packard in California for more than 25 ye…
Citation
John H. Lau; Chengkuo Lee; C. S. Premachandran; Yu Aibin: Advanced MEMS Packaging. About the Authors, Chapter (McGraw-Hill Professional, 2010), AccessEngineering Export