Acknowledgments


Please sign in to view the rest of this entry.

Acknowledgments
AcknowledgmentsDevelopment and preparation of 3D IC Integration and Packaging was facilitated by the efforts of a number of dedicated people. I would like to thank them all, with special mention of Asheesh Ratra of MPS Limited and Lynn Messina of McGraw-Hill Education for their unswerving support and advocacy. My special thanks go to Michael McCabe and Steve Chapman, who made my dream of this book come true by approving and effectively sponsoring the project, patiently listening to my excuses for delay, and solving many problems that arose during the book's preparation. It has been a great pleasure and fruitful experience to work with all of them in transferring my messy manuscript into a very attractive printed book.The material in this book clearly has been de…
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. Acknowledgments, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export