Preface


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Preface
Preface3D IC integration is taking the semiconductor industry by storm. It has been (a) impacting chip suppliers, fabless design houses, foundries, integrated device manufacturers, outsourced semiconductor assembly and test, substrates, electronics manufacturing services, original design manufacturers, original equipment manufacturers, material and equipment suppliers, universities, and research institutes; (b) attracting researchers and engineers from all over the world to go to conferences, lectures, workshops, panels, forums, and meetings to present their findings, exchange information, look for solutions, learn the latest technologies, and plan for their future; and (c) pushing the industry to build standards, infrastructures, and ecosystems for 3D IC integration.This is a perfect storm! People and com…
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. Preface, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export