About the Author


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About the Author
About the AuthorJohn H. Lau, Ph.D., has been a senior technical advisor at ASM Pacific Technology in Hong Kong since July 2014. Prior to that, he was a fellow of the Industrial Technology Research Institute in Taiwan for 4½ years; a visiting professor at Hong Kong University of Science and Technology for 1 year; the director of the Microsystems, Modules, and Components Laboratory at the Institute of Microelectronics in Singapore for 2 years; and a senior scientist/MTS at Hewlett-Packard Laboratory/Agilent in California for more than 25 years.Dr. Lau's professional competences are design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic, optoelectronic, LED, CIS, and MEMS components and systems, w…
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. About the Author, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export