3D IC Packaging


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3D IC Packaging
1010608 3D IC Packaging
Introduction As mentioned in Chap. 1, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. 3D IC/Si integrations use TSVs (through-silicon vias), but 3D IC packaging does not. Chapters 1 through 13 of this book have dealt with TSVs, which are the most important key enabling technologies of 3D IC/Si integration. In this chapter, the focus is on 3D IC packaging, wh…
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. 3D IC Packaging, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export