3D CMOS Image Sensor and IC Integration


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3D CMOS Image Sensor and IC Integration
1010608 3D CMOS Image Sensor and IC Integration
Introduction The basic function of CMOS (complementary metal-oxide semiconductor) image sensor is to convert light (photons) into electronic signals (electrons). CIS (contact image sensor) has a huge market with portable, mobile, wearable, and automotive products and is a key element of the IoTs (Internet of Things). For example, smartphones and tablets use CISs for their cameras, and automobiles use CISs for their machine visions. In general, a CIS consists of a matrix of micro lens, transistors and metal wiring, and PD (photodiode) [1…
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. 3D CMOS Image Sensor and IC Integration, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export