3D MEMS and IC Integration


Please sign in to view the rest of this entry.

3D MEMS and IC Integration
1010608 3D MEMS and IC Integration
Introduction MEMS stands for microelectromechanical systems, which is the integration of mechanical elements such as sensors and actuators and electronics on a common silicon substrate through the use of microfabrication technology [1–4]. The same basic technology and process steps, such as etching, patterning, doping, and connecting, employed for making convent…
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. 3D MEMS and IC Integration, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export