3D LED and IC Integration


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3D LED and IC Integration
1010608 3D LED and IC Integration
Introduction 3D LED (light-emitting diode) and IC integration packages are discussed in this chapter. These packages consist of the single- or multi-LEDs and either active IC (integrated circuit) chip such as the ASIC (application-specific IC), LED driver, processor, memory, RF (radio frequency) sensor, and power controller in a 3D manner or passive interposer in a 2.5D manner. The assembly processes of these packages are also presented and discussed. Specifically, 2.5D IC and LED integrations, such as (a) LED packaging using silicon substrate with cavities for phosphor printing and copper-filled TSVs for interconnection; …
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. 3D LED and IC Integration, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export