Embedded 3D Hybrid Integration


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Embedded 3D Hybrid Integration
1010608 Embedded 3D Hybrid Integration
Introduction A low-cost (with bare chips) and high-performance (optical, electrical, thermal, and mechanical) optoelectronic system embedded into a PCB (printed circuit board) or an organic laminated substrate is designed and described in this chapter. This system consists of a rigid PCB (or a substrate) with an embedded optical polymer waveguide, an embedded VCSEL (vertical cavity surface emitted laser), an embedded driver chip, an embedded serializer, an embedded photodiode detector, an embedded TIA (transimpedance amplifier), an embedded deserializer, embedded heat slugs, and a heat spreader.
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. Embedded 3D Hybrid Integration, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export