Thermal Management of 2.5D/3D IC Integration


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Thermal Management of 2.5D/3D IC Integration
1010608 Thermal Management of 2.5D/3D IC Integration
Introduction One of the critical issues of 2.5D/3D IC integration is its thermal management. This is because (1) 3D circuits increase total power generated per unit surface area; (2) chips in the 3D stack may overheat if proper and adequate cooling is not provided; (3) the space between the 3D stack may be too small for cooling channels (i.e., no gap for air flow); and (4) thin chips may create extreme conditions for on chip hot spots. Thus, low-cost and effective thermal management solutions are desperately needed for widespread use of 2.5D/3D IC integration and are therefore also the …
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. Thermal Management of 2.5D/3D IC Integration, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export