3D IC Integration with Passive Interposer


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3D IC Integration with Passive Interposer
1010608 3D IC Integration with Passive Interposer
Introduction 2.5D IC integration with an interposer has been discussed in Chap. 7. 3D IC integration with an interposer will be the focus of this chapter. Emphasis is placed on (1) interposer with double-sided chip attachments, (2) interposer with chips on both sides, and (3) low-cost interposer for 3D IC integration. The advantages of 3D IC integration with a TSV/RDL passive interposer will be briefly mentioned first.
3D IC Int…
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. 3D IC Integration with Passive Interposer, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export