2.5D/3D IC Integration


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2.5D/3D IC Integration
1010608 2.5D/3D IC Integration
Introduction Unlike 3D Si integration (as shown in the left-hand side of Fig. 7.1), 3D IC Integration (as shown in the right-hand side of Fig. 7.1) is defined as stacking up whatever Moore law's IC thin chips in the 3rd dimension with TSVs (through-silicon vias) and microbumps [1–63] to achieve high performance and density, low consumption power, wide bandwidth, small form factor, and light weight. For 3D IC integration, microsolder bump…
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. 2.5D/3D IC Integration, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export