3D Si Integration


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3D Si Integration
1010608 3D Si Integration
Introduction As mentioned earlier, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and in general the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two use TSV but 3D IC packaging does not. In this chapter, the origin of 3D integration is presented. Also, the evolution, challenges, and outlook of 3D Si integrations are discussed. The electronic industry will be briefly mentioned first. 3D IC integration will be discussed in Chaps…
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. 3D Si Integration, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export