Microbumps: Fabrication, Assembly, and Reliability


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Microbumps: Fabrication, Assembly, and Reliability
1010608 Microbumps: Fabrication, Assembly, and Reliability
Introduction As mentioned earlier, 3D IC integration is defined as stacking up whatever Moore's law IC thin chips in the third dimension with TSVs and solder microbumps [1–75] to achieve high performance, low power consumption, wide memory bandwidth, and small form factor. Thus solder microbumps are one of the important enabling technologies for 3D IC integration. The ordinary solder bumps (∼100 μm) for flip chip applications [
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. Microbumps: Fabrication, Assembly, and Reliability, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export