Package Substrate Technologies


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Package Substrate Technologies
1010608 Package Substrate Technologies
Introduction For 3D IC integration, either it is a memory cube on logic, memory-on-SoC (system-on-chip), logic-on-logic, or interposer supporting chips, the package substrate is a must! Why? Because if the 3D IC integration module is mounted directly on a PCB (printed circuit board), due to the thermal expansion mismatch between the Si chips or Si interposer and the FR-4 epoxy PCB, the solder joints are subjected to very large stresses and strains and an underfill is usually needed for the solder joint reliability. Even with the reworkable underfills, however, the quality of the reworked PCB is degraded. Thus, th…
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. Package Substrate Technologies, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export