Stress Sensors for Thin-Wafer Handling and Strength Measurement


Please sign in to view the rest of this entry.

Stress Sensors for Thin-Wafer Handling and Strength Measurement
1010608 Stress Sensors for Thin-Wafer Handling and Strength Measurement
Introduction The generation of stress during manufacturing, packaging, and testing of the semiconductor devices is an inevitable phenomenon. Understanding these stress data is important for process selection, devices reliability, and fabrication yield. Piezoresistive stress sensors are known to be a potential device to measure the stresses in the semiconductor device packages [1–37]. Edwards et al. [
Citation
John H. Lau, Ph.D.: 3D IC Integration and Packaging. Stress Sensors for Thin-Wafer Handling and Strength Measurement, Chapter (McGraw-Hill Professional, 2016), AccessEngineering Export